In the semiconductor manufacturing process, ultra-pure chemicals are used to clean the products. To prevent contamination, these chemicals must not contain any trace metals. ppt-level pollutants can cause corrosion, erosion, electromigration, and device short circuits in wafers or electronic components. Therefore, quality control in the industry chain includes the analysis of chemicals and reagents in the process, such as ultra-pure water, high-purity reagents, and light. Resist, specific organic additives, transition metals, trace elements in electroplating baths, inorganic anions and cations, polyvalent ions and organic complexing agents, etc.
Fig.1 The process flow involved in semiconductor materials (the red part is the application link of wet electronic chemicals).
The High Purity Chemicals Analysis cases include, but are not limited to the following:
- Analysis of multi-element nanoparticle
Significance:
Analyzing the presence of NP in chemical raw materials is very important. If there are particles between the two metal lines, it may cause a short circuit, and surface defects will affect the growth of the new material layer on the silicon wafer.
Detection method:
Using single-particle inductively coupled plasma mass spectrometry can directly measure the nanoparticles in the sample solution.
- Analysis of Trace Metal Impurities in High Purity Nitric Acid
Significance:
HNO3 plays an important role in the manufacture of semiconductor devices, so ultra-high purity is required. HNO3 is also mixed with phosphoric acid and acetic acid for the wet etching of aluminum. It can also be used as a reagent to prepare other semiconductor materials.
SEMI standard:
The HNO3 (69.0%-70.0%) SEMI standard C35-0708 Class B program stipulates that the pollutant concentration of several elements should be<1 µg/L (ppb)
Detection method:
Direct analysis of undiluted HNO3 using tandem quadrupole ICP-MS/MS. This method can simplify sample preparation and avoid the introduction of contaminants during the dilution process.