Semiconductor integrated circuits are the core components of electronic products and are critical to the quality control of electronic devices such as diodes, resistors, and printed circuit boards (PCBs). 

Wafer/Epitaxial layer (impurities/stress/defects)

• Evaluation of residual stress by Raman spectroscopy
• Analyze trace elements in semiconductor materials through chemical analysis (ultra-trace impurities/surface contamination elements of SiC wafers)
• Observe the defects of SiC and GaN wafers and epitaxial layers with ULC-SEM-CL
• Observe stacking defects/dislocations of SiC wafer and epitaxial layer by Cs-corrected STEM

Device Microstructure

• EELS/EDX analysis of the gate oxide film/SiC interface of SiC power devices by Cs-corrected STEM and TEM
• EDX/EELS analysis of diode metal/SiC interface by Cs-corrected STEM
• Observe the interlayer insulation film/defects by FIB-SEM

Analysis of Installed Components

• Ultrasonic focused beam internal observation
• Cross-section observation of the interface of power device composite materials
• SEM observation of the wire bonding part of power device/IC
• SEM-EDX and EBSP analysis of weld joint/wire alloy phase
• Identify the debonding interface with micro-focus radiography/ultrasound microscope
• SEM observation of the solder/nickel coating-Cu interface alloy phase and the peeled part of the welded joint interface

Detection Technology

• Thermal measurement
• Two-dimensional spectrum measuring device for defects of SiC substrate
• A high-precision infrared thermal imaging camera measures the temperature of power devices

Industries That Use Electronic Failure Analysis

• Semiconductor
• Aerospace
• Computer
• Consumer appliances
• Electricity company
• Electronic parts
• Government
• Industrial control
• Automobile industry